PDR IR-E2
BGA/SMT REWORK STATION FOR SMALL/MEDIUM
PCBS
Features
- Advanced Focused IR component heating
- Quartz IR PCB preheating with up to 3 zones
- 18”/450mm PCB Capacity
- Split Beam prism system for simultaneous PCB/component viewing
- Precision Components Pick and Placement up to 10um
- Professional PCB handling
- Component Nest/Flux Application Facility
- Non-Contact Component Temperature Sensing
- Contact Probe PCB Temperature Sensing
- Advanced Automatic Thermal Process Control
Applications
Desoldering, placement and soldering of all types of surface mounted devices (SMD)
BGA, QFN, LED, CSP, 0201, 01005
Technical Data
- Bench Area: 1400mm (w) x 600mm (d)
- Weight: 65kg
- Warranty: 2 years
- Voltage Frequency: 208-240 volts 50/60Hz, up to 3.5KW
- Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
- PCB Preheater Power: 3250 Dark IR
- PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mm
- Number of PCB Preheater Zones: 3 Zones
- Spot Size Included: F700 (Ø 25-70mm)
- Component Placement: Split Beam Prism Alignment/x50 Magnification
- Placement Accuracy: Up to 10um
- Component Temperature Sensing: Non-Contact IR Sensor
- PCB Temperature Sensing: Contact Probe
- Max PCB Size: 12 x 18”/300 x 450mm
- Max Component Size: 2.1 x 2.1”/55 x 55mm
- Min Component Size: 01005
- Number of TC Channels: 4
- Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 10+
Features
- Advanced Focused IR component heating
- Quartz IR PCB preheating with up to 3 zones
- 18”/450mm PCB Capacity
- Split Beam prism system for simultaneous PCB/component viewing
- Precision Components Pick and Placement up to 10um
- Professional PCB handling
- Component Nest/Flux Application Facility
- Non-Contact Component Temperature Sensing
- Contact Probe PCB Temperature Sensing
- Advanced Automatic Thermal Process Control
Technical Data
- Bench Area: 1400mm (w) x 600mm (d)
- Weight: 65kg
- Warranty: 2 years
- Voltage Frequency: 208-240 volts 50/60Hz, up to 3.5KW
- Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
- PCB Preheater Power: 3250 Dark IR
- PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mm
- Number of PCB Preheater Zones: 3 Zones
- Spot Size Included: F700 (Ø 25-70mm)
- Component Placement: Split Beam Prism Alignment/x50 Magnification
- Placement Accuracy: Up to 10um
- Component Temperature Sensing: Non-Contact IR Sensor
- PCB Temperature Sensing: Contact Probe
- Max PCB Size: 12 x 18”/300 x 450mm
- Max Component Size: 2.1 x 2.1”/55 x 55mm
- Min Component Size: 01005
- Number of TC Channels: 4
- Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 10+
Applications
Desoldering, placement and soldering of all types of surface mounted devices (SMD)
BGA, QFN, LED, CSP, 0201, 01005
